Semiconductor and Other Electronic Component Manufacturing H-1B Sponsors in Pennsylvania
48 employers in the Semiconductor and Other Electronic Component Manufacturing industry filed 336 certified H-1B Labor Condition Applications for Pennsylvania worksites (FY2021–2026). The median offered wage is $100K/year, with the middle 50% between $74K and $120K.
Top Semiconductor and Other Electronic Component Manufacturing H-1B Sponsors in Pennsylvania
| Employer | Certified Filings | Median Wage |
|---|---|---|
| TE Connectivity Corporation | 98 | $120K |
| Intel Corporation | 65 | $114K |
| Innovative Electronics Corporation | 39 | $71K |
| SMG GLOBAL CIRCUITS, INC. | 11 | $62K |
| SMG Global Circuits, Inc. | 11 | $71K |
| PHILIPS NORTH AMERICA LLC | 10 | $96K |
| Microchip Technology Inc. | 10 | $77K |
| Intel Corporation | 8 | $110K |
Ranked by certified filing volume at Pennsylvania worksites, FY2021–2026.
Reading Industry-Level H-1B Data
Industry here is NAICS code 3344, the classification the employer reported on the filing itself, so this counts every Pennsylvania employer that classified itself in Semiconductor and Other Electronic Component Manufacturing, not a curated list.
A certified Labor Condition Application is a step toward an H-1B petition, not an approved visa. Wages are the offered wage, which the employer must set at or above the DOL prevailing wage for the role and area, so the $100K median reflects Pennsylvania rates rather than a national figure.
Semiconductor and Other Electronic Component Manufacturing H-1B Filings in Other States
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H1B Visa Jobs Research Team
Counted from US Department of Labor LCA disclosure files (FY2021–2026) for NAICS industry group 3344, Semiconductor and Other Electronic Component Manufacturing, certified petitions with annual wages between $30K and $1M, filtered to Pennsylvania worksites. A certified LCA is a step toward an H-1B petition, not an approved visa.